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Thermally Conductive Gap Fill

SilCool* TIA225GF

2.5 W/mK – Low Temperature, Fast Cure, Thixotropic Gap Filler

  • Good thermal conductivity
  • Low temperature cure (70°C or even at Room Temperature)
  • Easy to use 1:1 mixing ratio by weight or volume
  • UL Listed

SilCool TIA241GF

Liquid Dispensed Silicone Thermal Pad / Gap Filler

  • Good thermal conductivity 4W/m/K
  • Fast, low temperature cure
  • Convenient 1:1 mix ratio by weight
  • Retained softness after cure for enhanced stress relief during thermal cycling

SilCool TIA223G-DG

Thermal encapsulating, gap filling, and thermal interface for electronic components

  • Good thermal conductivity 2.2W/m/K
  • Fast cure with exposure to heat
  • Easy to use 1:1 mixing ratio by weight or volume

Thermally Conductive Adhesive

SilCool XE13-C1862PT

Thermally Conductive Silicone Adhesive

  • 2.5 W/m/ K thermal conductivity
  • Low viscosity
  • Higher elongation than conventional products
  • Ready to use: one component

SilCool* TIA350R

1 Part Thermally Conductive Adhesive;

  • 3.5 W/m/ K thermal conductivity
  • Low temperature 100°C, fast cure
  • Wide temperature range
  • Easy to use one component formulation semi flowable material

Thermally Conductive Potting Compound

SilCool* TIA208R

Thermally Conductive Silicone Potting Compound

  • Primerless adhesion to metals and plastics
  • Good thermal conductivity (0.7 W/m∙K)
  • Low viscosity 4000cps
  • Easy to use 1:1 mixing ratio
  • Cures and adheres quickly with heat or at room temperature
  • Flame retardant : UL94V-0
  • UL Listed

SilCool TIA216G

Thermally Conductive Silicone Potting Compound

  • SilCool™ TIA216G is a 2 component, thermally conductive potting material
  • Good Thermal Conductivity (1.6 W/m∙K)
  • Low Viscosity
  • Fast cure with exposure to heat
  • Room temperature cure capability
  • Easy to use 1:1 mix ratio by weight & volume
  • Reparability
  • Non-corrosive to metals
  • UL 94V-0 Compliance (file number E56745)

SilCool TIA219R

Thermally Conductive Silicone Potting Compound

  • SilCool™ TIA219R is a two-component, heat curable silicone rubber designed for thermally conductive applications
  • Soft, elastomeric rubber properties
  • Convenient 1:1 mix ratio by weight
  • Outstanding stress relief
  • Heat accelerated or room temperature cure
  • Excellent thermal conductivity (1.9 W/m∙K)
  • Resistance to temperature extremes
  • Primerless adhesion to many types of substrates
  • Non corrosive to metal
  • Low volatile
  • UL 94V-0 (equivalent)

Thermally Conductive Compound

SilCool TIS420C

Thermally Conductive Compound

  • SilCool™ TIS420C is a one component, thermally conductive gap filler
  • High thermal conductivity (4.2 W/m∙K)
  • Physical stability due to polymerisation during cure process
  • Soft, stress-absorbing post cure properties
  • Can be dispensed in various thickness
  • Conforms to intricate shapes and component designs
  • Use within a broad operating temperature range
  • Repairable

SilCool TIS370

Thermally Conductive Silicone Compound

  • SilCool™ TIS370C is a one component, thermally conductive silicone compound
  • It cures upon exposure to atmospheric moisture to form a cured rubber exterior surface, while maintaining a pasty mass consistency.
  • High Thermal Conductivity (3.7 W/m∙K)
  • Hot and cold temperature resistance, enabling use in operating temperature ranges of –40~150°C
  • Extremely low oil bleed and volatile contents, leading to stability under high temperature environments
  • Non-corrosive to metals

Thermally Conductive Grease

SilCool* TIG210BX

1 Part Thermally Conductive Pre Cured Gel

  • 2.1 W/m/ K thermal conductivity
  • Wide temperature range -40 to +150
  • Easy to use one component formulation dispensable gel
  • Electrically insulative.
  • Resists pump out

SilCool TIG300BX

Thermally Conductive Silicone Grease

  • 3 W/m/ K thermal conductivity
  • Low oil bleed and minimal weight loss at elevated temperatures
  • Wide operating temperature range (-40°C ~ 150°C)
  • Minimal ionic impurities
  • Easy to use one component formulation dispensable gel
  • Electrically insulative.
  • Resists pump out

SilCool TIG400BX

Thermally Conductive Silicone Grease

  • 4 W/m/ K thermal conductivity
  • Wide operating temperature range -40 °C to 170 °C
  • Low volatility
  • Easy to use one component formulation dispensable gel
  • Electrically insulative.
  • Resists pump out

SilCool TIG1000BX

Thermally Conductive Silicone Grease

  • Good thermal conductivity
  • Wide operating temperature range -40 °C to 170 °C
  • Low volatility
  • Easy to use one component formulation dispensable gel
  • Electrically insulative.
  • Resists pump out

Did You Know?

Thermally Conductive Products, Thermally Conductive Products

Guide To Silicones

Thermally Conductive Products, Thermally Conductive Products

FDA / MIL / UL / USP

Thermally Conductive Products, Thermally Conductive Products

Need Information?

Thermally Conductive Products, Thermally Conductive Products

Disclaimer

Each user bears full responsibility for making its own determination as to the suitability of Supplier’s materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Supplier’s products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Supplier’s standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Supplier. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Supplier covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.

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