Acquisition strengthens silicone offering On September 9th TECHSiL Ltd (part of the Diploma PLC) purchased…
Thermal Interface Materials
Thermal Interface Materials Products
Product Selection
With a large number of thermal interface materials being available, choosing the correct product for a specific application can be seen as a problem. The following information and the attached product guide are designed to help in selection.
Application: Thermal interface in high performance devices and semiconductor packages as TIM1 interfaces or TIM2 thermal paths to heat sinks
Product options : TIG830SP – 4.1 W/m.K , TIG400BX – 4.0 W/m.K, TIG300BX – 3.0 W/m.K, TIG210BX – 2.1 W/m.
Performance Characteristics
- Wide operating temperatures
- Repairability
- Low thermal resistance
- Minimal ionic impurities
- Thin bond lines
Product options : TIA350R – 3.5 W/m.K, TIA260R – 2.6 W/m.K, XE13-C1862PT – 2.5 W/m.K
Performance Characteristics
- Structural adhesion
- Minimal ionic impurities
- Low thermal resistance
- Thin bond lines
- Wide operating temperatures
Application: Thermal management for optical pick-ups, automotive control units and power supplies
Product Options : TIA0260 – 2.6 W/m.K, TIA0220 – 2.2 W/m.K
Performance Characteristics
- Structural adhesion
- Low thermal resistance
- Room temperature cure
Product Options: TIS380CM – 3.6 W/m.K, TIS420C – 4.2 W/m.K
Performance Characteristics
- Non-adhesive, repairable
- Low thermal resistance
- Room temperature cure
Application: Thermal interface with heat dissipation devices in control units, medium performance chip sets etc.
Product Options : TIG1000 – 1.0 W/m.K, TIG2000 – 2.0 W/m.K
Performance Characteristics :
- Moderate thermal conductivity
- Wide operating temperatures
Product Options : TSE3281-G – 1.7 W/m.K, TSE3280-G – 0.9 W/m.K
Performance Characteristics
- Moderate thermal conductivity
- Structural adhesion
- Low thermal resistance
Application: Board level and power supply component assembly
Product Options: TIA0260 – 2.6 W/m.K, TIA0220 – 2.2 W/m.K, XE11-B5320 – 1.3 W/m.K
Performance Characteristics
- Moderate thermal conductivity
- Structural adhesion
- Low thermal resistance
- Room temperature cure
Application : Rubber and Gel potting / encapsulation in power modules, converters, IGBT units.
Product Options: TIA222G – 2.2 W/m.K, TIA216G – 1.6 W/m.K
Performance Characteristics
- Good thermal conductivity
- Low ~ moderate viscosities
- Stress relief
- Handling and cure benefits
- Repairability
For more information on Thermally Conductive Material Design Criteria call Silicone Solutions on 01204 863290 or click here
For more information on the complete range of products available from Silicone Solutions click here
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