Thermally Conductive Material Selection

Thermally Conductive Material Selection

The task of component design challenges materials suppliers to address an array of thermal management applications that impose a variety of performance and process profiles. Momentive brings to this challenge a broad and versatile range of thermally conductive materials.

Whether an application requires Momentive ans Silicone Solutions offer a solution to help match the application’s parameters

• Superior performance in thermal interfaces
• General heat dissipation in assemblies
• Thermal performance in board-level assembly
• Potting and encapsulation

Application: Thermal Interface in high performance devices and semiconductor packages as TIM1 interfaces or TIM2 thermal paths to heat sinks.

Products : TIG830SP 4.1 W/m.K , TIG400BX 4.0 W/m.K, TIG300BX 3.0 W/m.K, TIG210BX 2.1 W/m.K

Performance Characteristics

• High thermal conductivity
• Wide operating temperatures
• Repairability
• Low thermal resistance
• Minimal ionic impurities
• Thin bond lines

Products: TIA600R 6.0 W/m.K, TIA350R 3.5 W/m.K, TIA260R 2.5 W/m.K, XE13-C1862PT 2.5 W/m.K

Performance Characteristics

• High thermal conductivity
• Structural adhesion
• Minimal ionic impurities
• Low thermal resistance
• Thin bond lines
• Wide operating temperatures

Application: Thermal management for optical pick-ups, automotive control units and power supplies

Products: TIA0260 2.6 W/m.K, TIA0220 2.2 W/m

Performance Characteristics

• High thermal conductivity
• Low thermal resistance
• Structural adhesion
• Room temperature cure

Products: TIS420C 4.2 W/m.K, TIA225GF 2.5 W/m.K

Performance Characteristics

• High thermal conductivity
• Low thermal resistance
• Non-adhesive, repairable
• Room temperature cure

Application: Thermal interface with heat dissipation devices in control units, medium-performance chipsets, etc.

Products: TIG1000 1.0 W/m.K, TIG2000 2.0 W/m.K

Performance Characteristics

• Moderate thermal conductivity
• Wide operating temperatures

Product: TSE3281-G 1.7 W/m.K

Performance Characteristics

• Moderate thermal conductivity
• Low thermal resistance
• Structural adhesion

Application: Board level & power supply component assembly.

Products: TIA0260 2.6 W/m.K, TIA0220 2.2 W/m.K, XE11-B5320 1.3 W/m.K

Performance Characteristics

• Moderate thermal conductivity
• Low thermal resistance
• Structural adhesion
• Room temperature cure

Application: Rubber and Gel potting / encapsulation in power modules, converters, IGBT units.

Products: TIA222G 2.2 W/m.K, TIA216G 1.6 W/m.K, TIA208R 0.7 W/m.K

Performance Characteristics

• Good thermal conductivity
• Handling & cure benefits
• Low ~ moderate viscosities
• Stress relief