Thermally Conductive Silicone Adhesive
XE13-C1862PT is a one-component, heat curable silicone adhesive designed for thermally conductive applications. The product cures quickly with heat and adheres well to a variety of substrates without the use of a primer.
Key Features and Typical Benefits
- Excellent thermal conductivity
- Low viscosity
- Higher elongation than conventional products
- Ready to use: one component
- Heat accelerated cure
- Excellent adhesive properties: Primerless adhesion to many types of substrates
- Non corrosive to metals
Potential Applications
- Sealing and bonding for thermally conductive applications
- Heat generating elements, Regulators, Rectifier, Thyristor, etc.
XE13-C1862PT Thermally Conductive Ahesive Typical Physical Properties
Typical properties are averaged data and should not be used as product specifications
- Colour – Grey flowable paste
- Viscosity (23 °C) – 50 PA-s
- Thermal conductivity – 2.5 W/m-K
- Adhesive strength – 0.9 MPa
- Glass transition point -120 °C
XE13-C1862PT Packaging
- 333ml cartridge available in cases of 10
Processing Recommendations
Materials such as water, sulfur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. contained in the surface of the substrate can inhibit curing. A sample patch should always be conducted before proceeding to determine compatibility.
- All parts should be as clean and dry as possible prior to application
- Wear eye protection and protective gloves as required when handling this product.
- Maintain adequate ventilation in the work area at all times.
Product Safety, Handling and Storage
- Store at cool temperature (0~10 °C) to prevent a viscosity increase. When returning to room temperature, allow the contents to return to room temperature before opening the container to avoid condensation.
- Keep out of the reach of children.
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
Need Information?
