TIA223G-DG Thermally Conductive Gap Fill

(Thermal encapsulating, gap filling, and thermal interface for electronic components)

TIA223G-DG is a 2-component, thermally conductive material for encapsulating, gap filling, and for use as a thermal path to heat sinks. The flowability of TIA223G-DG allows it to conform to complex 3-dimenstional shapes and cavities in potting applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.
TIA223G-DG quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.

KEY FEATURES

• Good thermal conductivity
• Fast cure with exposure to heat
• Easy to use 1:1 mixing ratio by weight or volume

APPLICATIONS

Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic components.

SilCool* TIA223G-DG Technical Data Sheet

TIA223G-DG Thermally Conductive Gap Fill Handling & Safety

• Parts A and B should each be thoroughly stirred before mixing together, as filler
  sedimentation may occur during storage.
• Deaerate the mixture for 5 to 10 minutes to remove air entrapped during mixing.
• Wear eye protection and protective gloves as required while handling the product.
• Use the product in a well ventilated area.

STORAGE

• Store in a dark, cool place out of direct sunlight

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.