A Selection Of Thermally Conductive Products Available
1 Part Thermally Conductive Adhesive;
- 3.5 W/m/ K thermal conductivity
- Low temperature 100°C, fast cure
- Wide temperature range
- Easy to use one component formulation semi flowable material
Silicone Adhesive Products Available Online
2.5 W/mK – Low Temperature, Fast Cure, Thixotropic Gap Filler
- Good thermal conductivity
- Low temperature cure (70°C or even at Room Temperature)
- Easy to use 1:1 mixing ratio by weight or volume
- UL Listed
Thermally Conductive Silicone Encapsulant
- Primerless adhesion to metals and plastics
- Good thermal conductivity (0.7 W/m∙K)
- Low viscosity 4000cps
- Easy to use 1:1 mixing ratio
- Cures and adheres quickly with heat or at room temperature
- Flame retardant : UL94V-0
- UL Listed
1 Part Thermally Conductive Pre Cured Gel
- 2.1 W/m/ K thermal conductivity
- Wide temperature range -40 to +150
- Easy to use one component formulation dispensable gel
- Electrically insulative.
- Resists pump out
Thermally Conductive Silicone Adhesive
- 2.5 W/m/ K thermal conductivity
- Low viscosity
- Higher elongation than conventional products
- Ready to use: one component
Thermally Conductive Silicone Grease
- 4 W/m/ K thermal conductivity
- Wide operating temperature range -40 °C to 170 °C
- Low volatility
- Easy to use one component formulation dispensable gel
- Electrically insulative.
- Resists pump out
Thermally Conductive Silicone Grease
- 3 W/m/ K thermal conductivity
- Low oil bleed and minimal weight loss at elevated temperatures
- Wide operating temperature range (-40°C ~ 150°C)
- Minimal ionic impurities
- Easy to use one component formulation dispensable gel
- Electrically insulative.
- Resists pump out
Thermally Conductive Silicone Grease
- Good thermal conductivity
- Wide operating temperature range -40 °C to 170 °C
- Low volatility
- Easy to use one component formulation dispensable gel
- Electrically insulative.
- Resists pump out
Liquid Dispensed Silicone Thermal Pad / Gap Filler
- Good thermal conductivity 4W/m/K
- Fast, low temperature cure
- Convenient 1:1 mix ratio by weight
- Retained softness after cure for enhanced stress relief during thermal cycling
Thermal encapsulating, gap filling, and thermal interface for electronic components
- Good thermal conductivity 2.2W/m/K
- Fast cure with exposure to heat
- Easy to use 1:1 mixing ratio by weight or volume
Disclaimer
Each user bears full responsibility for making its own determination as to the suitability of Supplier’s materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Supplier’s products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Supplier’s standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Supplier. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Supplier covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right.