(2.1 W/m /K – Pre Cured Gel)
One-component, Thermal Interface Compound (pre-cured), with minimal weight loss at elevated temperatures & excellent reliability performance
Silicone Adhesive Products Available Online
Key Features
- 2.1 W/m/ K thermal conductivity
- Wide temperature range -40 to +150
- Easy to use one component formulation dispensable gel
- Electrically insulative.
- Resists pump out
Applications
- TIM materials provide a heat path from a heat source to a heat dissipation device
- Automotive under bonnet electronics
SilCool keeping your Electronics COOL and enhancing LIFE TIME!
Test Setup / Pump Out Simulation by Thermal Shock (-40° to 150°C)
Vertical Position – INITIAL 45° Position – INITIAL
Thermal Compounds – Reliability Data
Performance after 250h Thermal Shock
Bleed Out – BX Series – Significant Bleed-Out Improvement
TIG210BX and competitor grade dispensed on smoked glass plates exposed to 150C for 24 h
Material properties – Flow Out
Low bleeds leads to physical stability in application
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
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