SilCool* TIA219R Thermally Conductive Compound

(2 component, thermally conductive silicone rubber with adhesion function)

SilCool™ TIA219R is a two-component, heat curable silicone rubber designed for thermally conductive applications from Momentive Performance Materials.

SilCool™ TIA219R cures with heat to form an elastic, thermally conductive rubber and adheres well to various types of materials such as metals, plastics, glass and ceramics without the use of primers.

SilCool™ TIA219R quickly cures with exposure to heat to a soft rubber that helps relieve stress on critical electronic components

Key Features

• Soft, elastomeric rubber properties
• Convenient 1:1 mix ratio by weight
• Outstanding stress relief
• Heat accelerated or room temperature cure
• Excellent thermal conductivity
• Resistance to temperature extremes
• Primerless adhesion to many types of substrates
• Non corrosive to metal
• Low volatile
• UL 94V-0 (equivalent)

Applications

Thermally conductive silicone rubber with adhesion function designed for thermally conductive applications.

General Considerations for Use

Materials such as water, sulphur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. contained in the surface of the substrate can inhibit curing. Pre-testing of a sample patch to determine compatibility is recommended.

SilCool* TIA219R Technical Data Sheet

Characteristics of SilCool* TIA219R Thermally Conductive Silicone Rubber with adhesion function

• Uncured Properties
  • TIA219R (Part A) appearance Grey
  • TIA219R (Part B) appearance White
  • Mix ratio by weight 1:1
  • Viscosity Part A : Pas 9.0
  • Viscosity Part B : Pas 7.0
  • Viscosity after mixing mPas 8.0
  • Work Life at 23°C 3 Hours
  • Cure Time @ RT 24 Hours
  • Cure Time @ 70°C 0.5 Hours
  • Cure Time @ 120°C 0.3 Hours
  • SilCool is a trademark of Momentive Performance Material Inc
• Cured Properties (30 minutes @ 70°C)
  • Appearance – Grey
  • Density 23°C – 2.7 g/cm³
  • Hardness – 50 Shore E
  • Tensile strength 0.8 MPa
  • Elongation 100%
  • Thermal Conductivity  – 1.9W/mK
  • Dielectric strength – 18 kV/mm
  • Typical properties – are average data and are not to be used as or to develop specifications

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.