Liquid Dispensed Silicone Thermal Pad / Gap Filler
SilCool TIA241GF gap filler is a 2-component, soft, thermally conductive silicone material used to dissipate heat from electronic devices. Its non-slumping pasty consistency offers physical stability that can allow improved processing. SilCool TIA241GF gap filler can be used as a liquid dispensed alternative to pre-fabricated thermal pads in a broad array of thermal designs for electronic applications
Key Features & Typical Benefits
- Good thermal conductivity
- Fast, low temperature cure
- Convenient 1:1 mix ratio by weight
- Retained softness after cure for enhanced stress relief during thermal cycling
- Excellent slump resistance (stays in place)
- Repairable
- Flame retardant: UL94V-0 equivalent
- Glass bead options available (180 & 250μm) for bond line thickness (BLT) control
TIA241GF Thermally Conductive Gap Fill Typical Physical Properties
Uncured properties
- Appearance Part A – Blue
- Appearance Part B – Pale Blue
- Viscosity Part A – 250 Pa•s
- Viscosity Part B – 130 Pa•s
- Mix ratio by weight – 1:1
- Viscosity after mixing – 130 Pa•s
- Thixo index – 2.6
- Work life at 23 °C – 3 hours
- Cure condition at 100 °C – 0.25 hours
- Cure condition at 70 °C – 0.5 hours
- Cure condition at 23 °C – 24 hours
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
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