(1 component, thermally conductive gap filler)
SilCool™ TIS420C is a one component, thermally conductive gap filler from Momentive Performance Materials.
SilCool™ TIS 420C is designed for use on thermal interfaces for electronic components in consumer and automotive applications.
This thixotropic paste cures at room temperature to become a mechanically stable silicone gel. Due to its curing performance, SilCool TIS420C provides improved stability in 3-dimensional and vertical TIM applications that require a stress-absorbing, pump-out resistant, mechanically stable and repairable heat path.
Key Features
- High thermal conductivity
- Physical stability due to polymerisation during cure process
- Soft, stress-absorbing post cure properties
- Can be dispensed in various thickness
- Conforms to intricate shapes and component designs
- Use within a broad operating temperature range
- Repairable
Applications
For use on thermal interfaces for electronic components in automotive and consumer applications
General Considerations for Use
Substrate surface should be thoroughly cleaned with a suitable solvent such as alcohol, xylene, methyl ethyl ketone (MEK) etc. While handling wear eye protection and protective gloves as required. Adequate ventilation must be maintained in the work place at all times.
Characteristics of SilCool* TIS420C Thermally Conductive Gap Filler
- Uncured Properties
- TIS420C : appearance Grey, Paste
- Viscosity : Pas 300
- Viscosity Part B : Pas 6.6
- Tack free time : 5minutes
- SilCool is a trademark of Momentive Performance Material Inc
- Cured Properties (2days @ 23°C, 50%RH)
- Appearance – Grey Gel
- Density 23°C – 3.2 g/cm³
- Thermal Conductivity – 4.2W/mK
- Dielectric strength – 5.0 kV/0.25mm
- Typical properties – are average data and are not to be used as or to develop specifications
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
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