(3.5 W/m /K – Low Temperature, Fast Cure, Adhesive)
TIA350R is a one-component, heat curable silicone adhesive designed for thermally conductive applications.
TIA350R cures quickly upon exposure to heat, and adheres well to a wide variety of substrates.
Key Features
- 3.5 W/m/ K thermal conductivity
- Low temperature 100°C, fast cure
- Wide temperature range
- Easy to use one component formulation semi flowable material
- Electrically insulative.
- Primerless adhesion to many substrates
- Non-corrosive to metals
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Applications
- TIM materials provide a heat path from a heat source to a heat dissipation device
- Thermal Interface Material between dies and heat spreaders.
- Adhesive for use between various heat sources and heat dissipation devices.
Inside the Package
- Thermal path between chip & heat spreader
- Requires structural adhesion
- Ability to withstand thermal stress
Outside the Package
- Thermal path between heat spreader/ Sink
- Repair ability commonly required
Tensile Strength increases at higher temperatures (more force is needed to break the silicone)
Slight elongation change at higher temperatures (TIA350R is still flexible)
TIA350R can be cured at different temperatures, longer cure time might be required
Low thermal resistance values (TR) of 24mm²K/W with BLT (Bond Line Thickness) of ~60μm can be achieved with this material
Aging Data – TIA350R
Test conditions: Sandwich material between 10mmx10mm silicon dies, assemble at 300kPa and cure at 120C for 30 minutes.
Measure thermal resistance using laser flash.
Thermal Shock Conditions: -55C ~ +150C, dwell time 30 minutes at each extreme.
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
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