SilCool* TIA225GF Thermally Conductive Gap Fill

(2.5 W/mK – Low Temperature, Fast Cure, Thixotropic Gap Filler)

TIA225GF is a 2-component, thermally conductive silicone material for encapsulating, gap filling, and for use as a thermal path to heat sinks.

The flowability of TIA225GF allows it to conform to complex 3-dimensional shapes and cavities in gap filling applications, while also enabling it to be transferred in a thin layer as a liquid-dispensed alternative to thermal pads.

TIA225GF quickly cures to a soft rubber gel with exposure to heat, and will also cure at room temperatures.

Characteristics of SilCool* Liquid Dispense Gap Fillers:

• 2-Part Addition Cure
• Low Temperature Fast Cure
  • 70C x 30 minutes
  • Ability to Cure @ Room Temperature
• Stay-in-Place post-dispense shape retention
• Offer Best-In-Class levels of softness and stress-relief during thermal cycling
• V-0 UL certified

Flow Test During Cure – TIA225GF stays in position even at 60° angle (no flow visible)

No Flow During Cure – TIA225GF at Room Temperature or 70°C visible

Elasticity – Enhanced flexibility – No cracking of TIA225GF visible (elastic)

Advantages vs. Thermal Pads

• Thinner Bond Lines
• Conforms to non-planar surfaces
• Can conform to 3D designs
• Less stress on components
• No need for pre-cut / die-cut
• No tearing or damage during use

Advantages vs. Thermal Grease

• Elimination of Pump-Out
• Elimination of Dry-Out
• Easier to repair

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.