(2 component, thermally conductive potting material)
SilCool™ TIA216G is a 2 component, thermally conductive potting material from Momentive Performance Materials.
Developed to be used primarily on complex thermal interface designs. The product has a low viscosity which allows it to conform to intricate shapes, enabling the reduction of contact interference.
TIA 216G quickly cures to a 40 Shore E soft rubber/gel consistency with exposure to heat and retains a tacky adhesion on its cured surface.
Key Features
- Good Thermal Conductivity
- Low Viscosity
- Fast cure with exposure to heat
- Room temperature cure capability
- Easy to use 1:1 mix ratio by weight & volume
- Reparability
- Non-corrosive to metals
- UL 94V-0 Compliance (file number E56745)
Applications
Thermal encapsulating, gap filling, and thermal interface to heat sinks in various electronic components.
General Considerations for Use
Materials such as water, sulphur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. contained in the surface of the substrate can inhibit curing. Pre-testing of a sample patch to determine compatibility is recommended.
Characteristics of SilCool* TIG216G Thermally Conductive Potting Compounds
- Uncured Properties
- TIG216G (Part A) appearance Grey
- TIG216G (Part B) appearance White
- Mix ratio by weight 1:1
- Viscosity Part A : Pas 9.5
- Viscosity Part B : Pas 6.6
- Viscosity after mixing mPas 7.8
- Work Life at 23°C 2 Hours
- Cure Time @ RT 6 Hours
- Cure Time @ 70°C 0.5 Hours
- SilCool is a trademark of Momentive Performance Material Inc
- Cured Properties (30 minutes @ 70°C)
- Appearance – Grey
- Density 23°C – 2.69 g/cm³
- Hardness – 40 Shore E
- Thermal Conductivity – 1.6W/mK
- Dielectric strength – 20 kV/mm
- Typical properties – are average data and are not to be used as or to develop specifications
*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.
Did You Know?
Guide To Silicones
FDA / MIL / UL / USP
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