SilCool* TIA208R Thermally Conductive Silicone Encapsulant

Fast cure (2 component room temperature curable) thermally conductive potting
material

TIA208R has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature, to not only metallic substrates, but to also difficult to adhere plastics such as Polycarbonate.

TIA208R’s adhesion capabilities are especially important for electronic potting applications that require IP standard water ingress performance

Applications

• LED Ballasts
• DC / DC Converters
• Micro-Inverters
• Automotive Electric Vehicles
• Water ingress resistant electronic potting

Potting in LED Light Bulbs

• 2 identical E26 lightbulbs with thermocouple attached to capacitor.
• One potted with TIA208R the other Unpotted
• Turn the bulbs on and measured operating temperature with ambient temperature 24.5°C

TIA208R resulted in a 16 % reduction in operating temperature

Curing Behaviour

• Although curing is possible at various temperatures, higher temperatures result in higher hardness and adhesion strength build.
• Even when cured in ovens for 30 min, there is a gradual increase in hardness and adhesion strength that continues for approximately 7 days.

Temperature and Viscosity Relationship

Stable properties under harsh operating conditions

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.