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TIA225GF Thermally Conductive Gap Fill

Click Here To Download Detailed TIA 225GF Technical Data Sheet

TIA225GF Description –  Liquid Dispensed Silicone Thermal Pad

TIA225GF silicone is a two-component thermally conductive material that is dispensed as a liquid and cured in place to create a heat path for efficient heat transfer. After being applied, its non-slumping pasty consistency provides physical stability to help prevent run-off after being dispensed. TIA225GF can be used as a liquid-dispensed alternative to pre-fabricated thermal pads, and as a gap filler for a broad array of thermal designs in electronic components.

TIA225GF Thermally Conductive Gap Fill Available Online

Key Features and Typical Benefits

  • Good thermal conductivity
  • Fast low-temperature cure
  • Retains softness after cure to enhance stress relief during thermal cycling
  • Easy to use 1:1 mixing ratio
  • Conforms to complex shapes of three-dimensional interface designs
  • Can be dispensed or printed
  • Repairable
  • Flame retardant: UL94V-0 equivalent

TIA225GF Potential Applications

Thermal interface for electronic components in consumer, telecommunications, automotive, and lighting applications.

General Considerations For Use

As materials such as water, sulfur, nitrogen compounds, organic metallic salts, phosphorus compounds, etc. contained in the surface of the substrate can inhibit curing, a preliminary test should be performed to determine compatibility.


  • TIA225GF(A): 25kg pail
  • TIA225GF(B): 25kg pail

Product Safety, Handling and Storage

Customers should review the latest Safety Data Sheet (SDS) and label for product safety information, safe handling instructions, personal protective equipment if necessary, emergency service contact information, and any special storage conditions required for safety. Momentive Performance Materials (MPM) maintains an around-the-clock emergency service for its products. SDS are available at upon request, from any Silicone Solutions.

For product storage and handling procedures to maintain the product quality within our stated specifications, please review Certificates of Analysis, which are available in the Order Center. Use of other materials in conjunction with MPM products (for example, primers) may require additional precautions

For more information on the complete range of Thermally Conductive Silicone adhesives, encapsulants and potting compounds available from Silicone Solutions click here 

For more information on TIA225GF  Thermally Conductive Gap Fill click here

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