Thermally Conductive Silicone Potting

TIA208R is a fast cure (2 component room temperature curable) thermally conductive potting material for electronic applications in addition to providing low viscosity thermal potting,
TIA208R has the unique benefit of providing primerless adhesion when cured at both elevated heat or at room temperature, to not only metallic substrates, but to also difficult to adhere plastics such as Poly-Carbonate.
TIA208R’s adhesion capabilities are especially important for electronic potting applications that require IP standard water ingress performance.

Key Features

Key Applications

Thermally Conductive Silicone Potting Available Online

Although curing is possible at various temperatures, higher temperatures result in higher hardness and adhesion strength build.
Even when cured in ovens for 30 minutes there is a gradual increase in hardness and adhesion strength that continues for approximately 7 days.

Momentive offer the following grades of thermal potting materials TIA207GN, TIA208R, TIA216G, TIA219R and TIA222G
All are two part addition cure with a rubber cured property
TIA208R carries UL94 Recognition
Selected models offer low volatility
Viscosity (cps) range from 4,500 to 20,000
All have a mixing ratio of 100:100
Pot life range from 1 to 4 hours
Momentive Thermal Potting materials are available in black and grey
Specific gravity ranges from 1.6 to 2.81
Thermal conductivity (W/mk) ranges are from 0.7 to 2.2