Thermal Management Silicones For Electronics

SilCool* Silicone Grease Compounds

Momentive’s range of SilCool series silicone grease compounds feature outstanding thermal conductive and dielectric properties, excellent workability, virtually
no oil separation, and minimal weight loss at elevated temperatures. These high-performance grease products were formulated to help address heat management
challenges resulting from higher frequencies, higher power, and miniaturization in the development of electric and electronic devices.

Thermal Resistance is proportional to the thickness of the material through which the heat must travel. The ability to control and reduce thickness (BLT) of the thermal interface is a key factor in the component assembly process. Increases in assembly pressures are known to contribute to reductions in BLT, and subsequently, reduced thermal resistance.

Key Features

• Highly workable – excels in automated dispensing, screen printing, and stamping applications
• High thermal conductivity
• Wide operating temperature range
• Low oil separation and minimal weight loss at elevated temperatures
• Minimal ionic impurities & excellent dielectric properties

SilCool* Silicone Adhesive – Addition Cure

The SilCool series silicone adhesives from Momentive Performance Materials offer 1-Part, heat curable materials that bond well to a wide variety of substrates without the need for primers. They help deliver outstanding thermal conductivity, low thermal resistance, excellent dielectric properties, and low stress. SilCool adhesives are
excellent candidates for addressing the heat management challenges arising from the higher frequencies, power, and miniaturization in today’s electronic devices. Designed to efficiently conduct heat, these materials are valuable additions to semiconductor packages that incorporate heat generating chips, heat spreaders, and heat sinks (TIM1 & TIM2).

Key Features

• Highly workable – excels in automated dispensing, screen printing, and stamping applications
• Fast cure & good adhesion
• High thermal conductivity
• Low thermal resistance
• Wide operating temperature range
• Compatible with high-temperature lead-free processing
• Minimal ionic impurities & excellent dielectric properties