Acquisition strengthens silicone offering On September 9th TECHSiL Ltd (part of the Diploma PLC) purchased…
Snapsil TN3305 Silicone Adhesive Sealant
SnapSil* TN3305 One-component, low volatile siloxane, silicone adhesive sealant
SnapSil TN3305 is a one-component, low volatile siloxane, silicone adhesive sealant that cures at room temperature upon exposure to atmospheric moisture and exhibits primerless adhesion to many substrates.
Key Features & Benefits of SnapSil TN3305
- Fast tack-free time
- Low volatility
- Non-corrosive to most metals
- Primerless adhesion to many substrates
- Low odor cure: releases an alcohol vapor during cure
- Flame retardant (UL94 HB, File No. E56745)
Snapsil TN3305 Available Online
Potential Applications of SnapSil TN3305
- Insulating adhesive seal and fixing for electronic and electrical parts.
- Waterproof sealant for electronic, electrical and communication equipment
- General adhesive for metals, plastics, glass, etc.
Typical Physical Properties
Uncured Properties
Appearance – Flowable, clear, white, black
Viscosity (23°C) Pa•s – 47
Tack-free Time (23 °C) min – 9
Cured Properties (3 days at 23 °C, 50% RH)
Appearance – Elastic rubber, clear, white, black
Density (23 °C) g/cm3 – 1.04
Hardness (Type A) – 14
Tensile Strength MPa – 1.5
Elongation % – 400
Adhesion Strength(1) MPa – 1.0
Volatile Siloxane(2) (D3-D10) wt% – 0.01
Volume Resistivity – 2.0×1015
Dielectric Strength kV/mm – 26
Dielectric Constant (60Hz) – 2.7
Dissipation Factor (60Hz) – 0.002
Typical SnapSil TN3005 Cure Profile
SnapSil TN3305 silicone adhesive sealant cures upon exposure to atmospheric moisture, and its cure speed is affected by humidity and temperature. The material begins to cure from the sections that are
exposed to the atmosphere and, therefore, greater time is required for the cure to extend to deeper sections.
The cure depth of TN3305 silicone adhesive sealant at various combinations of humidity and temperature are provided below
Adhesion Performance
TN3305 silicone adhesive sealant adheres to a wide variety of substrates used in electronic components. The following matrix depicts adhesion performance to typical substrates. However, actual
performance may vary depending on the substrate manufacturer or grade