Momentive Performance Materials developed its family of SilCool thermally conductive adhesives to help deliver thin bond lines, which contribute to low thermal resistance while providing excellent adhesion and reliability.
This series of heat-cured adhesives excel in thermal interface applications that demand good structural adhesion. Examples include spreaders and heat generators, and thermal interfaces to heat sinks in TIM2 applications.
Additional thermal adhesives from Momentive offer the process convenience of 1-Part condensation cure with moderate heat dissipation.
Target applications include board assemblies and sealants in power modules and sensors.